NEK IEC 60191-6-21:2010
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
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| Fra | Til | Abonnement | Engangskjøp | Status |
|---|---|---|---|---|
| 25. mai 2026 | Nåværende | Ikke tilgjengelig | 1 303 kr | Kan kjøpes |