NEK IEC 60191-6-17:2011
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
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| Fra | Til | Abonnement | Engangskjøp | Status |
|---|---|---|---|---|
| 26. mai 2026 | Nåværende | Ikke tilgjengelig | 3 239 kr | Kan kjøpes |